Dual-Target Magnetron Sputtering Coater for Advanced Thin Film Deposition

Product Details
Customization: Available
After-sales Service: on Site Installation and Online Support
Warranty: 12 Months
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  • Dual-Target Magnetron Sputtering Coater for Advanced Thin Film Deposition
  • Dual-Target Magnetron Sputtering Coater for Advanced Thin Film Deposition
  • Dual-Target Magnetron Sputtering Coater for Advanced Thin Film Deposition
  • Dual-Target Magnetron Sputtering Coater for Advanced Thin Film Deposition
  • Dual-Target Magnetron Sputtering Coater for Advanced Thin Film Deposition
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Basic Info.

Model NO.
KS-2HD-300M
Application
Industry, School, Lab
Customized
Customized
Structure
Desktop
Material
Stainless Steel
Transport Package
Wooden Package
Specification
850mm× 760mm× 660mm
Trademark
kunsheng
Origin
Luoyang City, Henan
HS Code
8486202200
Production Capacity
500 Sets Per Year

Product Description

Dual-Target Magnetron Sputtering Coater for Advanced Thin Film DepositionProduct Description
KS-2HD-300M dual-target magnetron sputtering system is a high-end vacuum coating equipment independently developed. It is used for the preparation of single-layer or multilayer thin films such as conductive films, alloy films, semiconductor films, ceramic films, optical coatings, and intermediate layers.
The system integrates two independent sputtering sources: one dedicated to non-conductive material sputtering (RF power supply) and one dedicated to conductive material sputtering (DC power supply).
It offers advantages of compact design, flexible operation, wide material compatibility, and ease of use, making it an ideal solution for laboratory research and pilot-scale production across various material categories.
 
Main Features
  • Equipped with two independent sputtering targets: one powered by RF source for insulating materials, and one powered by DC source for conductive materials.
  • Suitable for various types of targets and flexible applications.
  • Compact structure, reliable performance, and convenient operation.

Technical Parameters:
Product Model KS-2HD-300M dual head sputtering coater
Input Power  220V / 50Hz
Number of Targets  2 independent sputtering guns
Chamber Size  φ300mm× 330mm
Substrate Cooling  Water-cooled substrate holder
Ultimate Vacuum  ≤9.0×10-4 Pa
Pumping System  VRD-16 dry pump + RF-100/150 turbo molecular pump
Pumping Time  ≤30 minutes to reach ≤3.0×10-³ Pa
Gas Flow Control 1 line for Argon gas (100sccm max)
2 lines for mixed gases (200sccm max), customizable
Film Thickness Range  0.1-1.5mm (depending on material)
Substrate Rotation  φ140mm holder, speed adjustable from 1-20rpm
Heating Capability  Room temperature to 1000°C (optional customization)
System Dimensions 900mm (W) × 650mm (D) × 1100mm (H)

 

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