30L Large-Capacity Plasma Cleaning System/Cleaner for Multi-Level Surface Treatment Solution

• Customization: Available
• After-sales Service: on Site Installation and Online Support
• Warranty: 12 Months
• Model NO.: KS-PL-DW30
• Application: Industry, School, Lab
• Customized: Customized
• Structure: Desktop
• Material: Stainless Steel
• Transport Package: Wooden Package
• Specification: 300× 335× 300 mm (L× W× H)
• Trademark: kunsheng
• Origin: Luoyang City, Henan
• HS Code: 8486209000
• Production Capacity: 500 Sets Per Year

Product Description

KS-PL-DW30 Large-Capacity Plasma Cleaning System - High-Precision, Multi-Level Surface Treatment Solution
The KS-PL-DW30 is a large-chamber plasma cleaning system engineered for high-throughput applications requiring superior cleaning performance, high precision, and batch versatility. With a 30-liter chamber volume and multi-layer electrode plate design (3-5 floors), this system enables uniform plasma distribution across multiple components, making it ideal for industrial-scale cleaning, surface activation, and modification processes.
Constructed with a corrosion-resistant 316 stainless steel inner chamber, the KS-PL-DW30 provides excellent durability and chemical compatibility. The chamber measures 300×335×300 mm, accommodating a wide range of part sizes and configurations. Its vertical cabinet structure (700×650×1200 mm) offers a compact footprint for cleanrooms and production environments while delivering industrial-level performance.
The system operates at a high-frequency 13.56 MHz RF power source with automatic impedance matching, ensuring consistent and efficient plasma discharge across all electrode layers. With a power output of 0-500W (continuously adjustable), the machine supports various process requirements, including low-power treatment of delicate materials and high-power decontamination of complex parts.
Gas control is managed through an ultra-precision dual-channel electro-flowmeter, allowing for fine regulation of reactive gases such as argon, oxygen, CF₄, and more. A high-vacuum silicon sensor provides real-time vacuum level monitoring from 1-30 Pa, ensuring optimal process conditions at all times.

The KS-PL-DW30 features a fully automated control system with a PLC-based interface and HMI touchscreen for real-time monitoring, recipe storage, and customizable control. Users can easily set cleaning durations up to 99999 seconds, track process parameters, and switch between manual and automatic modes based on operational needs.
A powerful BSV30 vacuum pump with 10 L/S pumping speed enables fast evacuation and chamber stabilization, minimizing downtime between processing cycles. With chamber temperature maintained below 30°C, the system is suitable for use with heat-sensitive materials like polymers, thin films, and optical components.
The KS-PL-DW30 is widely used in the electronics, semiconductor, LED, and medical device industries for cleaning, etching, and enhancing surface adhesion. Whether used for oxide removal, photoresist stripping, or increasing wettability before bonding or coating, the KS-PL-DW30 ensures clean, consistent, and contamination-free results.
For operations requiring a scalable plasma solution with high precision, automation, and durability, the KS-PL-DW30 is a reliable and versatile platform for advanced plasma surface processing.
Technical Parameters:

Model	KS-PL-DW30
Cavity material	316 stainless steel surface treatment
Cavity size	300×335×300 mm (L×W×H)
Cavity capacity	30L
Electrode plates	3-5 floors
Form factor	700×650×1200 mm (L×W×H)
Power frequency	13.56 MHz (automatic matching integration)
Power supply	0-500W (continuously adjustable)
Flowmeter	Ultra-precision 2-way electro-flowmeter
Vacuometer	High vacuum silicon measurement and real-time display
Control mode	Fully automatic control and manual (PLC HMI)
Cleaning time	0-99999 s adjustable
Vacuum level	1-30 Pa
Chamber temperature	<30°C
Supply voltage	380V
Vacuum pump	BSV30 (speed 10 L/S)