High-Vacuum 4-Source Organic-Inorganic Evaporation Coating with Glove Box Interface Reserved

• Customization: Available
• After-sales Service: on Site Installation and Online Support
• Warranty: 12 Months
• Model NO.: KS-EVP-4S
• Application: Industry, School, Lab
• Customized: Customized
• Structure: Desktop
• Material: Stainless Steel
• Transport Package: Wooden Package
• Specification: 400× 400× H450 mm
• Trademark: kunsheng
• Origin: Luoyang City, Henan
• HS Code: 8486202200
• Production Capacity: 500 Sets Per Year

Product Description

Product Description:
This high-vacuum evaporation coating system KS-EVP-4S integrates both organic and inorganic evaporation sources, making it suitable for research and small-scale production involving materials such as Cu, Ag, C60, LiF, and others. The system features a square stainless steel chamber with a polished interior surface and a dual-door vertical structure. The front door adopts a double-rail sliding mechanism to save glovebox space and enhance appearance, while the rear door is hinged for easy manual access.
The vacuum chamber is designed with multiple observation windows equipped with anti-contamination glass shields for clear process monitoring. Inside the chamber, there are four thermal boat evaporation sources for metal deposition and two organic source ovens, enabling flexible material combinations and multi-layer deposition.

A motorized substrate holder is installed at the top of the chamber, offering rotation and water cooling. The substrate-to-source distance can be manually adjusted, and a pneumatic shutter is included to protect the substrate before deposition begins.
The system is equipped with a dual-pump vacuum configuration consisting of a molecular pump and a mechanical pump, providing rapid evacuation and high vacuum levels. Real-time vacuum monitoring is achieved using a combination gauge covering a wide pressure range from atmospheric to ultra-high vacuum.
For precise thickness control, the KS-EVP-4S system incorporates an imported INFICON SQC-310 film thickness monitor with PID feedback, allowing automatic adjustment of evaporation power to ensure stable and uniform coatings. Deposition uniformity is better than ±5%.
Automation is handled by a Siemens PLC and touchscreen HMI, offering both manual and fully automatic modes. The software allows users to set deposition rates, final film thickness, and includes full interlock protection for water flow, vacuum, temperature, and electrical faults, ensuring operator and equipment safety.
The entire system is mobile, mounted on universal wheels with leveling feet. It can be integrated with a glovebox to facilitate operation in inert gas environments. All key components, including vacuum valves, gauges, power supplies, and temperature controllers, are selected from reliable and well-known brands to guarantee long-term stable performance.
This system is widely used in universities, research institutes, and enterprises for advanced material research, thin film development, and process exploration.
Technical Parameters:

Product Model	KS-EVP-4S
Chamber Material	304L stainless steel, internal mirror polished
Chamber Dimensions	400×400×H450 mm
Chamber Structure	Front & rear door opening with observation windows
Base Pressure	Better than 3.0×10^-5Pa
Leak Rate	Better than 5×10^-8Pa·L/s
Pump System	Molecular pump FF-200/1300 + Mechanical pump BSV30
Pumping Time	≤20 min from atmosphere to 5×10^-4 Pa
Vacuum Measurement	One combined gauge (two low, one high)
Substrate Stage Size	150×150 mm
Substrate Rotation Speed	0-30 RPM adjustable
Substrate Cooling	Water-cooled
Source to Substrate Distance	Manually adjustable, up to 50 mm
Metal Evaporation Sources	4 thermal boats with 2.4 kW power supply
Organic Sources	2 sources with temperature control (up to 700°C)
Crucibles	Quartz crucibles with Japanese temperature controller
Deposition Control	INFICON SQC-310 film thickness monitor
Thickness Control Accuracy	0.01 Å
Uniformity	Better than ±5%
Control System	Siemens PLC + Touch screen (manual/auto mode)
Protective Features	Water flow, temperature, pressure, vacuum alarms and interlocks
Sealing	Magnetic fluid feedthroughs with FKM and copper gaskets
Cooling Water Flow	15-20 L/min, temperature 15-25°C
Compressed Air	0.55-0.6 MPa, clean and dry
Nitrogen Gas	0.1-0.2 MPa, dry N2 for chamber venting
Power Supply	380 VAC ±5%, 50Hz, Max. 8 kW, 32A
Mobile Base	Equipped with universal wheels and levelers
Integration	Compatible with glove box system
Main Application	Thin film R&D for organic and metal materials (e.g. Cu, Ag, C60, LiF)